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化学共沉积法Ag基触头材料性能研究 被引量:1

Properties of Ag-Based Contact Materials Prepared by Chemical Co-deposition Method
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摘要 采用化学共沉积法制备了AgSnO_2(12)、AgSnO_2(11.5)Bi_2O_3(0.5)及AgSnO_2(0.5)Bi_2Sn_2O_7(11.5)3种触头材料,并对其力学物理性能和模拟电性能进行了对比研究。结果表明:AgSnO_2(0.5)Bi_2Sn_2O_7(11.5)较AgSnO_2(12)和AgSnO_2(11.5)Bi_2O_3(0.5)熔焊力值小,电弧能量值低。 AgSnO2(12), AgSnO2(11.5)Bi203(0.5) and AgSnO2(0.5)Bi2Sn207(11.5) are prepared by chemical co-deposition method, and their mechanical and physical properties, simulated electrical properties are studied. The results show that the welding force of AgSnO2(0.5)Bi2Sn207(11.5)is smaller than that of AgSnO2(12) and AgSnO2(11.5)Bi203(0.5), and the arc energy of AgSnO2(0.5) Bi2Sn207(11.5) is lower than that of AgSnO2(12) and AgSnO2(11.5)Bi203(0.5).
作者 王奐然 王振宇 罗加悦 WANG Huan-ran WANG Zhen-yu LUO Jia-yue(Guilin Electrical Equipment Scientific Research Institute Co., Ltd., Guangxi Guilin 541004, China)
出处 《电工材料》 CAS 2017年第3期7-10,14,共5页 Electrical Engineering Materials
关键词 银氧化锡 触头材料 力学物理性能 模拟电性能 AgSnO2(12) contact materials mechanical and physical properties simulated electrical properties
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