挠性板用电解铜箔的黑色表面处理及其性能研究

Black surface treatment and performance of electrolytic copper foil used for flexible printed circuit

对挠性印刷电路板(FPC)用超低轮廓(VLP)铜箔进行黑色表面处理,通过电镀钴-镍合金,得到了均匀的黑色外观,该处理过程不使用对人体及环境有严重危害的砷化合物。对铜箔进行性能测试发现,该黑色表面处理的电解铜箔具有良好的可蚀性,且蚀刻线条经盐酸浸泡后基本无侧蚀。铜箔的抗氧化性能优异,在耐潮湿及高温试验中均无氧化变色现象,光面微蚀也无条纹、斑点等异常。此外,铜箔的抗拉强度、延伸率、抗剥离强度及耐弯曲等性能也表现优异,能很好地满足挠性印刷电路板的生产要求。

Blackened the surface of very - low profile （VLP） copper foil used for flexible printed cir- cuit （FPC） boards by electrodepositing Co -Ni alloy. Obtained uniform black appearance, and the process didn＇ t use arsenic compounds which were harmful to human health and the environment. After the perpromance test, found that the elctrolytic copper foil which was treated with black surface had good corrosion resistance, and there was almost no lateral erosion on the etched line which was soaked in hydrochloric acid. The oxidation resistance of the copper foil was excellent. There were no oxidation discoloration phenomenon on the copper foil after the moisture and high temperature test, and no abnormity on the smooth side of the copper foil after microetching such as streaks or spots. In addition, the performance of tensile strength, elongation percentage, peel strength and bending resistance were exceedingly good, which can well meet the production requirements of FPC.