摘要
Teradyne J750测试系统功能强大、测试精度高,是全球装机量最大的自动测试设备。以一款MCU芯片的晶圆级测试为例,主要阐述了其在美国Teradyne公司生产的J750大规模集成电路测试系统上的测试方案开发与实现。介绍了J750测试系统的主要特点,开展晶圆级测试开发的一般步骤:包括测试设备评估、测试适配器加工、离线程序编写、在线测试程序调试等。程序部分主要关注功能项和频率计数测试,对调试异常情况进行研究等。通过开展16site并完成整枚晶圆的测试,根据探针台生成的Map文件,可以查看到该圆片的批号、片号、测试坐标及对应管芯的测试结果表征值,即Bin值。
Teradyne J750 test system is a automatic test equipment with world＇s largest installed capacity because of its powerful function and high test precision. Here takes a wafer test of MCU chip as an example, mainly expounds the develop and implement of a test method used on a LSI testing system from Teradyne company. The main features of J750 test system is recommended, and the general steps of developing and debugging of test program in wafer test is descripted, including evaluating test equipment, processing test adapter, off-line programming and debugging online testing procedures, etc..The program part mainly focus on the function test and frequency counter and research on debugging abnormalitis. After testing the whole wafer by carrying out 16site,, it can show the wafer piece number, batch number, coordinate and bin value, according to the Map file generated by the prober.
出处
《微处理机》
2017年第4期23-26,共4页
Microprocessors
