短路试验过程中热稳定性能的研究

Study on Thermal Stability of Short-Circuit Test

对电流密度计算的3个不同公式之间的关系进行推导分析,得出相互之间的关系。以铜导体为例,通过实际试验验证上述理论分析的正确性,并作为电器产品短路试验热稳定设计的依据。以电器产品的短时耐受试验为例,提出电器产品承受短时耐受电流试验的设计步骤,按照该步骤进行设计可以提高电器产品承受短路故障的性能。

This paper deduced and analyzed the three different equations about current-density calculation to obtain the relation between each other. Taking Cu conductor as example,the above theoretical analysis was proved to be correct through the actual test and was used as the basis of thermal stability design of electrical product shortcircuit test. Taking electrical product short-time with stand test as example,the design procedure of the test was proposed,which can improve the performance of electrical product to sustain short-circuit fault.