期刊文献+

一种兆赫频超声抛光振子的设计与研究 被引量:2

Research and Design of a High Frequency Megasonic Piezoelectric Polishing Vibrator
下载PDF
导出
摘要 在声波透射与折射基本理论的基础上,设计制作了匹配层压电换能器结构的兆声抛光振子,提高了兆赫频超声抛光工具的声能量辐射效率。此外,通过对兆声压电振子的振动模式进行控制,消除了高频圆片型压电振子本身存在的强烈的耦合振动效应。在制作完成兆声抛光振子的基础上,对抛光振子工作端的振动振幅进行了测试,在横向尺度上满足了兆声抛光工具头振动振幅均匀化的要求。实现了一种用于硅片化学机械抛光的兆声抛光振子。为大尺寸硅片的化学机械抛光工艺提供了可借鉴的附加技术手段。 Based on the theory of propagation of avo^tic wave, a high energy radiation efficiency megasonic polishing vibrator is designed and produced, In addition, aiming to obtain uniform vibration amplitude of the megasonic polishing tools, Vibration mode of the piezoelectric vibrator is controlled, the strong coupling vibration of piezoelectric vibrator is eliminated. Then, design and machining experiments needed polishing megosonie vibrator. The vibration amplitude of polishing tool is measured and proved to be uniform. This technology provides reference for chemical mechanical polishing of large size silicon wafer.
出处 《机械设计与制造》 北大核心 2018年第1期118-121,共4页 Machinery Design & Manufacture
基金 辽宁省科学计划项目(2015020159)
关键词 兆声 化学机械抛光 声传播 模式控制 压电振子 Megasonic Chemical Mechanical Polishing Silicon Wafer Mode Control Piezoelectric Vibrator
  • 相关文献

参考文献8

二级参考文献72

  • 1苏建修,郭东明,康仁科,金洙吉,李秀娟.ULSI制造中硅片化学机械抛光的运动机理[J].Journal of Semiconductors,2005,26(3):606-612. 被引量:14
  • 2张辽远 贾春德.超声加工中对 M.C.Shaw理论实验验证[J].沈阳工业学院学报,1991,10(4).
  • 3川鸟正宪著 赖耿阳译.超音波工学理论实务[M].台南:夏汉出版社,1979..
  • 4隈部淳一朗著 韩一昆 薛万天译.精密加工振动切削[M].北京 :机械工业出版社,1985..
  • 5..http://www.brewerscience.com.,.
  • 6Zhu Yongwei, Xu Feng, Shen Jianliang, et al. Nanodiamond modified with SHP [ J ]. Key Engineering Materials, 2008, 359/360 : 19-22.
  • 7Zhao Yongwu, Chang L. A micro-contact and wear model for chemical-mechanical polishing of silicon wafers [ J ]. Wear, 2002,252(3/4) : 220-226.
  • 8Zhu Congrong, Xu Qin, Yuan Julong, et al. Experimental study on the uhraprecision lapping technology of the copper substrates for alloy films [ J ]. Key Engineering Materials, 2008, 359/360:349-354.
  • 9Zhai Wenjie, Liu Changxiong, Feng Peilian. Hydrodynamic analysis of circular translational polishing under mixed lubrication [ J ]. Key Engineering Materials, 2008, 359/360: 264 -268.
  • 10Luo Jianfeng, Donffeld D A. Material removal mechanism in chemical mechanical polishing: Theory and modeling [J]. Transactions on Semiconductor Manufacturing, 2001, 14 (2) : 112-133.

共引文献142

同被引文献12

引证文献2

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部