可溶性镍阳极对电镀镍性能的影响

Effect of Soluble Nickel Anode on the Performance of Electroplated Nickel

针对高纯镍阳极连续电解后,杂质元素(Fe、Zn、Cu、Cr)累积影响镀液与镀层质量的问题,采用3种高纯镍阳极材料连续溶解30 d,以模拟工业电镀进程的方法,研究了杂质元素对镀液与镀层质量的影响。通过赫尔槽实验、条形阴极法、中性盐雾实验等方法测试了8 d、30 d时镀液的电流效率、分散能力等性能,分析了8 d、30 d时镀液获取的镀层的外观、内应力和耐蚀性。结果表明,采用高纯度可溶性镍阳极,连续电解8 d,镀液与镀层性能未见明显改变;但电解至30 d时,镀层麻点增多,内应力增大、耐蚀性下降。国内外品牌对比发现,使用国内品牌1电解30 d时,镀液的铬杂质含量是最少的,为0.001 mg·L^-1,而国外品牌3电解30 d时,镀液的铁杂质含量是最少的,为0.090 mg·L^-1。镀层的微观形貌表明,对30 d的镀液进行"电解和循环过滤"后,能够有效提高镀液性能和镀层的质量。

In order to solve the problem that impurity elements(Fe,Zn,Cu,Cr)accumulate and affect the quality of plating solution and coating after continuous electrolysis of high-purity nickel anode,three kinds of high-purity nickel anode materials were dissolved continuously for 30 days to simulate the process of industrial electroplating,and the effect of impurity elements on the quality of plating solution and coating was studied.Through Hull cell experiment,strip cathode method,neutral salt spray experi⁃ment and other methods,the current efficiency,dispersion ability and other properties of the plating solution were tested at 8 d and 30 d,and the appearance,internal stress and corrosion resistance of the coating obtained at 8 d and 30 d were analyzed.The results show that the properties of the solution and coating have no obvious change after 8 days of continuous electrolysis with high purity soluble nickel anode,but after 30 days of electrolysis,the pitting of the coating increases,the internal stress increases and the corrosion resistance decreases.Compared with domestic and foreign brands,it is found that the chromium impurity content of the plating solution is the least(0.001 mg·L^-1)when using domestic brand one electrolysis for 30 days,while the iron impurity content of the plating solution is the least(0.090 mg·L^-1)when using foreign brand three electrolysis for 30 days.The coating morphology shows that the performance of the solution and the quality of the coating can be effectively improved after electrolysis and circulation filtration.