1017超薄半固化片填胶能力的研究

The study on the filling ability of 1017 prepreg

HDI厚度降低主要决定于基板和半固化片(PP)厚度。为了降低整体厚度,采用1017 PP叠构设计。1017 PP厚度在30μm左右,10层Anylayer整体设计厚度在0.45~0.55 mm之间,为终端产品厚度降低起到较大的贡献。文章主要针对1017 PP在设计、加工方面的特殊性进行测试研究,总结出1017 PP设计规则,加工方面主要包括填铜厚度能力、填胶空旷区大小等规则,以供同行业内参考。

The thickness of HDI board depends on the thickness of substrate and preperg(Pp).In order to reduce the overall thickness,1017Pp laminated design is adopted.The thickness of 1017Pp is about 30μm,and the overall design thickness of 10 layers of anylayer boars is between 0.45-0.55mm,which contributes greatly to the reduction of thickness of end products.In this paper,the particularity of 1017Pp in design and processing is tested and studied,and the design rules of 1017Pp are summarized.In processing,the rules mainly include copper filling capacity,rubber filling open area size and so on,which could be reference in the same industry.