印制电路板及元器件引脚振动分析

Vibration Analysis of Printed Circuit Board and Components Pins

航天产品发射升空过程中,会发生不可避免的振动,振动分析与振动控制是电子设备结构设计中必不可少的一部分,而印制电路板及其元器件是电子设备的关键部件。根据某航天产品内部的印制电路板结构及元器件分布,利用MSC.Patran建造有限元模型,为精确计算电路板及元器件响应,使用梁单元对FPGA元器件的引脚进行建模,再模拟引脚与焊盘的连接。使用MSC.Patran/Nastran有限元软件,分析了印制电路板的基频以及正弦振动与随机振动时的加速度和应力响应。结果表明电路板和FPGA元器件引脚可以承受火箭发射阶段的力学载荷。

Vibration is inevitable in the launching process of aerospace products. Vibration analysis and control is an essential part of electronic equipment structure design, and printed circuit board and its components are the key components of electronic equipment.According to the structure of printed circuit board and the distribution of components in an aerospace product, model with MSC. Patran was built. In order to accurately calculate the response of circuit board and components,using beam unit to simulate the pins of FPGA components,simulation of the connection between pin and PCB pads.Using MSC.Patran/Nastran software,the basic frequency, acceleration and stress response of PCB under sinusoidal vibration and random vibration were analyzed.The results show that the print circuit board and the pins of FPGA components can bear the mechanical load of rocket launching phase.