电子封装用清洗剂的研究进展

Progress of Cleaning Agents for Electronic Assembly

随着电子信息产业的蓬勃发展,三维封装技术和超摩尔定律随即诞生,极小的封装间距对电子产品的清洗提出了崭新要求。综述了电子封装用水基清洗剂的组成和作用机理,结合国内外电子封装用水基清洗剂的研究现状,着重介绍了水基清洗剂研制过程中成分、配比和浓度三者的关系,阐述了目前电子封装用水基清洗剂依旧存在适用范围小、兼容性差、难降解等问题,并探讨了未来电子封装用水基清洗剂的发展趋势。开发并推广一种绿色、高效和低成本电子封装用水基清洗剂尤为重要。

With the vigorous development of the electronic information industry,three-dimensional packaging technology and Super Moore’s law were born.Minimal packaging spacing put forward new requirements for cleaning electronic products.The work reviewed the composition and mechanism of water-based cleaning agent for electronic packaging.Based on the research status of water-based cleaning agents for electronic packaging at home and abroad,the relationship of composition,proportion and concentration in development of water-based cleaning agent was introduced.The problems such as small application scope,poor compatibility and difficult degradation of water-based cleaning agent for electronic packaging were illustrated.The development trend of water-based cleaning agent for electronic packaging was also discussed.It was very important to develop and promote a green,efficient and low-cost water-based cleaning agent for electronic packaging.