半导体制冷系统热端散热试验研究

Experimental research on the heat dissipation of the semiconductor refrigeration system

分别对TEC1-12704和TEC1-12706两种型号半导体制冷片的热端进行了散热器有热管散热与散热器无热管散热的试验装置设计,同时设计了分离电流输入两级制冷散热器有热管散热的试验装置,并分析了热端散热工况对冷端温度的影响。试验结果显示:散热器有热管散热可强化热端散热,半导体制冷片冷端温度与散热器散热能力有关,在有限散热能力条件下,冷端温度随输入电流的增加先增大后减小;保证散热能力条件下,冷端温度随输入电流增大而减小、随热端温度减小而减小;对双片TEC1-12706半导体制冷片采用分离电流输入两级制冷,冷端最低温度可达到-38.6℃。试验结果表明:改善热端散热条件能够提高单片半导体制冷片性能,同时在试验测试的最佳散热条件下采用分离电流输入两级制冷可使冷端温度大幅降低,这对提高半导体制冷片工作温差着重要的意义。

The radiator with heat pipe and the radiator without heat pipe were designed on the hot ends of two types of semiconductor cooler--TEC1-12704 and TEC1-12706,at the same time,the experimental device for two-stage cooling radiator with heat pipe was designed under the condition of separated current input,and the influence of hot end heat dissipation condition on the cold end temperature was analyzed by the experiment.The experimental results show that the radiator with a heat pipe for dissipation heat can enhance the heat dissipation at the hot end.The cold end temperature of the semiconductor cooler is related to the heat dissipation capacity of the radiator.Under the condition of limited heat dissipation capacity,the temperature of the cold end first increases and then decreases with the increase of the input current.Under the condition of ensuring the heat dissipation capacity,the temperature of the cold end decreases with the increase of the input current,and decreases with the decrease of the temperature of the hot end.The minimum temperature of the cold end can reach-38.6℃when two-stage refrigeration with separated current input is adopted for the two-sheet TEC1-12706 semiconductor cooler.The experimental results show that improving the heat dissipation conditions of the hot end can improve the performance of the monolithic semiconductor cooler.At the same time,the temperature of the cold end can be substantially reduced by using two-stage refrigeration with separated current input under the optimal heat dissipation condition,which is of great significance to improve the working temperature difference of semiconductor cooler.