高空机载电子设备冷却方法综述与优选

Comparison and Optimization of Cooling Methods for Airborne Electronic Equipment in High-altitude Environment

近年来,航空航天技术不断发展,机载设备朝向复杂化、集成化和小型化发展,随之而来的问题是设备发热量骤增;由于电子设备散热面积越来越小,传统机载电子设备冷却方法已经难以满足其散热需求。高空机载环境存在着低压力、低空气密度和飞机加速、失重等制约条件,机载冷却与近地面冷却性能存在着很多不同。对比了几种常见的机载电子设备冷却技术,重点分析几种技术的高空环境制约度,综合优选出最适合机载设备冷却的技术。考虑到单一冷却技术的局限性,评述了其中几种常见的复合冷却技术,并对未来的机载设备冷却进行了展望。

With the development of aerospace technology in recent years,the airborne equipment is developing towards complexity,integration and miniaturization.The problem that follows is the sudden increase in heat generation of the equipment.As the heat dissipation area of integrating electronic equipment is getting smaller,its heat dissipation requirements are too high for traditional airborne electronic equipment cooling methods to achieve.The high-altitude airborne environment has constraints such as low pressure,low air density,and aircraft acceleration and weightlessness.Therefore,there are significant differences between the performance of airborne cooling and near-ground cooling.Several common airborne electronic equipment cooling technologies were compared especially in the aspects of analyzing the high-altitude environmental constraints of several technologies.And then,the most suitable technology for the cooling of current airborne equipment was suggested.Considering the limitation of single cooling technology,several common composite cooling technologies were reviewed and future airborne equipment cooling methods were prospected.