摘要
针对半导体工艺与制造装备的发展趋势进行了综述和展望。首先从支撑电子信息技术发展的角度,分析半导体工艺与制造装备的总体发展趋势,重点介绍集成电路工艺设备、分立器件工艺设备等细分领域的技术发展态势和主要技术挑战。
The paper summarizes and prospects the development trend of semiconductor technology and manufacturing equipment.First,from the perspective of supporting the development of electronic information technology,the general development trend of semiconductor technology and manufacturing equipment is analyzed.Then,the technical development trend and main technical challenges in the sub areas of integrated circuit process equipment and discrete device process equipment are mainly introduced.
作者
周哲
付丙磊
董天波
芦刚
ZHOU Zhe;FU Binglei;DONG Tianbo;LU Gang(The CETC Electronic Equipment Group Co.,Ltd.,Beijing 100070,China;Unigroup Guoxin Microelectronics Co.,Ltd.,Beijing 100083,China;The 45th Research Institute of CETC,Beijing 100176,China)
出处
《电子工业专用设备》
2022年第4期1-7,11,共8页
Equipment for Electronic Products Manufacturing
关键词
半导体工艺
集成电路工艺
制造装备
摩尔定律
超越摩尔定律
新材料
Semiconductor process
Integrated circuit process
Manufacturing equipment
More moore
More-than-moore
New materials
