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翅片式液冷板强化换热研究

Research on enhanced heat transfer of finned liquid-cooling plate
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摘要 为了研究冲压翅片对液冷板传热及流阻特性的影响,采用计算流体力学的方法对由直通形翅片及锯齿形翅片两种散热翅片制成的液冷板进行分析,结果表明:在相同流量下,锯齿形液冷板的表面温度比直通形液冷板表面温度低9.09~9.17℃;在流量20 L/min下,锯齿形液冷板的平均传热热阻最小,其值为0.009 K/W;锯齿形液冷板的平均传热系数比直通形液冷板高61%~79%,锯齿形液冷板的平均传热系数最高可达4169 W/m2/K;此外,锯齿形液冷板内部流速更高,并且锯齿形液冷板流阻较直通形液冷板高6.57~25.4 kPa。 In order to study the influence of stamping fins on the heat transfer and flow resistance characteristics of liquid-cooling plates,this paper adopts the computational fluid dynamics method to analyze the liquid-cooling plates made of straight fins and serrated fins.The results show that,at the same flow rate,the surface temperature of the serrated liquid-cooling plate is 9.09℃to 9.17℃lower than that of the straight liquid-cooling plate.At the flow rate of 20 L/min,the average heat transfer resistance of the serrated liquid-cooling plate is the smallest(0.009 K/W).The average heat transfer coefficient of the serrated liquid-cooling plate is 61%to 79%higher than that of the straight liquid-cooling plate,and the average heat transfer coefficient of the serrated liquid-cooling plate can reach up to 4169 W/m 2/K.In addition,the internal flow velocity of the serrated liquid-cooling plate is higher,and the flow resistance of the serrated liquid-cooling plate is higher than that of the straight liquid-cooling plate by 6.57 kPa to 25.4 kPa.
作者 冯学文 朱单单 陈勇 FENG Xuewen;ZHU Dandan;CHEN Yong
出处 《现代机械》 2023年第5期82-86,共5页 Modern Machinery
关键词 冲压翅片 传热系数 热阻 流阻 stamping fin heat transfer coefficient thermal resistance flow resistance
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  • 1何叶,李磊民,杨涛.基于MEMS技术的新型微冷却方式[J].仪表技术与传感器,2004(9):43-45. 被引量:9
  • 2Yue Y,Solid State Electron,1996年,39卷,9期,1277页
  • 3Lasance C,Simons R.Advances in High-Performance Cooling for Electronics. Electronics Cooling . 2007
  • 4Sofia J W.Trends in Electronics Reliability Testing. http://www.analysistech.com .
  • 5Jim Wilson,Bruce Guenin.Cooling Solutions in the Past Decade. Electronics Cooling . 2005
  • 6Bakran M,Eckel H.Evolution of IGBT Converters for Mass Transit Applications. IEEE IAS . 2000
  • 7Luo Zhaohui.A Thermal Model for IGBT Modules and Its Implementation in a Real Time Simulator. . 2002
  • 8Kojima T,Yamada Y,Nishibe Y,et al.Novel RC compact thermal model of HV inverter module for electro-thermal coupling simu-lation. PCC Conf.Rec . 2007
  • 9Zhou Z,Holland P M,Igic P.Compact Thermal Model of a Three-Phase IGBT Inverter Power Module. 26th International Conference on Microelectronics . 2008
  • 10Lasance C.CFD Simulations in Electronic Systems:A Lot of Pitfallsand a Few Remedies. Electronics Cooling . 2005

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