均热板的研究现状及应用前景

Research Progress and Application Prospects of Vapor Chamber

随着第五代移动通信技术(5G技术)的出现与快速发展,电子产品尤其是智能手机、平板电脑等产品,愈发朝着高性能、高集成和微型化的方向发展,导致其在极端狭小空间下产生超高热流密度。均热板作为一种高效的传热元件,具有低热阻值和均温性特点,被广泛应用在高热流密度设备的散热模块中。本文综述了国内外均热板的研究现状,介绍了均热板的优势、传热原理、结构,总结了均热板建模仿真模拟的现状,分析评估了制备工艺等对均热板性能的影响,并提出微纳尺度铜基吸液芯制备方法和均热板可靠性评估方法,在此基础上,展望了均热板的应用前景及发展趋势。

The emergence and rapid development of the fifth-generation mobile communication technology has triggered the develop‐ment of electronic devices,especially smart phones and tablets PC,towards high performance,high integration and miniaturization,fur‐ther leading to ultra high heat flux in extremely narrow space.As an high efficient heat transfer element,vapor chamber with low resis‐tance and good temperature uniformity is widely used in the heat dissipation module of high heat flux equipment.In this paper,a de‐tailed overview of vapor chamber is firstly presented,including advantages,principle,and structures.The present situation of modeling and simulation of vapor chamber is summarized and the effect of manufacturing technology on heat transfer performance of vapor cham‐ber are analyzed and evaluated.The performance evaluation indicators are then provides.In this paper,the preparation method of mi‐cronano wick with copper material and the reliability evaluation method of vapor chamber are put forward.Based on the above,the ap‐plications and research trends are prospected.