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U型平板微热管LED散热器散热性能分析 被引量:1

Analysis of the heat dissipation performance of U-shaped flat plate micro-heat pipe LED radiator
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摘要 针对目前LED表面发热量较大,局部温度过高,而导致其使用寿命减少的问题,该研究以平板微热管为核心传热元件,与锯齿形翅片结合,设计了一种U型平板微热管散热器。采用试验和仿真模拟相结合的方法,对不同风速、翅片结构、翅高及翅间距等关键影响因素进行分析。结果表明:通过对比分析U型平板微热管在两种室外工况下各测点试验值和模拟值,散热稳定后温度的最大误差分别为4.2%和6.7%,验证了模型的可靠性。风速分别为0.5和3.0 m/s时,锯齿型翅片都具有良好的散热性能。当风速为3.0 m/s时,锯齿型翅片、W型翅片、直翅片散热器稳定后热源温度分别为34.3、35.5和39.1℃。为找到最佳工况和结构,进行了正交分析,当室外风速为3.5 m/s,锯齿型翅片翅高为12 mm,翅间距为8 mm时,U型热管具有较佳的散热性能。研究结果可为LED散热系统的设计提供数据参考和设计思路,拓宽LED光源的应用范围。 Light-emitting diode(LED)lighting has been increasingly prominent in the global market in recent years,due to the high luminous efficiency.Generally,the integrated LEDs products can inevitably generate a lot of heat,leading to the extremely high local temperature.However,LED cooling heat pipes in practical applications often face some challenges,such as insufficient contact thermal resistance and heat transfer area.In this study,a heat sink was designed to transfer the heat inside the LED out in time for the long life of the products.Micro heat pipe array(MPHA)was used to explore the impact of the structure on heat dissipation performance using computational fluid dynamics(CFD)software.Two models were established to compare with the experiment.The results show that the maximum error between the simulated and experimental values reached 39.62%at 0.5 m/s.Among them,the simulated value under forced convection was in good agreement with the experimental value,with the maximum error of 11.85%,indicating the accurate simulation.The heat dissipation of LEDs was varied greatly under the action of heat sinks with different structures.Moreover,the better uniformity of temperature was achieved in the U-shaped flat-plate micro heat pipe.Furthermore,the maximum difference of temperature was only 0.6℃for the MHPA in the vertical direction at an input power of 50W.The better uniformity of temperature was promoted the expansion of the heat exchange area,thus improving the heat transfer capacity of MHPA.The radiator was optimized to enhance the convective heat transfer rather than the heat dissipation.The verified model was used to simulate and analyze the five influencing factors(fin type,inlet wind speed,fin height and fin spacing)on the heat dissipation of LED heat sources.Research results show that the saw-shaped fins shared the larger area of effective heat conduction and better heat dissipation,compared with the traditional straight fins and W-fins.The better performance and heat transfer were achieved under 0.5 m/s or 3 m/s conditions.The convective heat transfer also increased,as the inlet wind speed increased.The heat dissipation under 3m/s conditions was much better than 0.5 m/s.However,the stable temperature drops of the LED heat source gradually slowed down,as the wind speed increased.The economic factors were considered in actual applications,such as the power consumption of the fan.It is necessary to select the wind speed the most suitable for the application scenario.Therefore,the smaller fin spacing and higher fin height of radiator structure can increase the effective heat transfer area and the heat dissipation performance of the heat sink.An orthogonal experiment was designed to determine the best working conditions and structure.The optimal combination was achieved in the forced convection and structure with an inlet wind speed of 3.5 m/s,a fin height of 12 mm and a spacing of 8 mm.The finding can provide new ideas to design the heat dissipation of lighting equipment for the service life and stability of LEDs.
作者 余万 韩煜 王岗 苏华山 胡涛 苏良彬 董裴芹 YU Wan;HAN Yu;WANG Gang;SU Huashan;HU Tao;SU Liangbin;DONG Peiqin(Hubei Key Laboratory of Hydroelectric Machinery Design&Maintenance,China Three Gorges University,Yichang 443002,China;College of Mechanical&Power Engineering,China Three Gorges University,Yichang 443002,China)
出处 《农业工程学报》 EI CAS CSCD 北大核心 2024年第9期227-235,共9页 Transactions of the Chinese Society of Agricultural Engineering
基金 国家重点研发计划项目(2022YFE0118500) 宜昌市自然科学研究项目(A23-2-011)。
关键词 数值模拟 试验 散热 U型平板微热管 翅片 正交分析 numerical simulation test heat dissipation U-type flat plate micro-heat pipe fins orthogonal analysis
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