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微电子机械系统(MEMS)面内位移的扫描离子束云纹法实验研究

A Study on the In-Plane Deformation of MEMS by using Scanning FIB Moiré Method
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摘要 本文提出应用扫描离子束云纹法测量微电子机械系统面内变形的新方法.对该方法的测量原理以及实验技术进行了详尽地阐述.通过平行云纹典型实验对本方法的测量精度进行了检验.成功地将扫描离子束云纹法应用于微悬臂梁表面氧化层随时间生长所引起的变形测量.实验结果表明了该方法的可行性. A new high resolution microscopic moiré method is proposed to measure the inplane deformation of object in a micrometer scale. The principle of this method and the accuracy of the deformation measurement are discussed in detail. The high resolution microscopic moiré method is successfully used to measure the surface strain evolution of a microcantilever under air oxidization. The results demonstrate the feasibility of this method.
出处 《实验力学》 CSCD 北大核心 2003年第1期12-16,共5页 Journal of Experimental Mechanics
关键词 扫描离子束云纹法 高频光栅 应变 微电子机械系统 面内变形 high resolution microscopic moiré method strain micro-electro-mechanical system(MEMS) in-plane strain
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参考文献2

  • 1[1]Sharpe W N, Jr., Turner K T, Edwards R L. Tensile Testing of Polysilicon [J]. Experimental Mechanics, 1999,39(3):161-169.
  • 2[2]Post D, Han B, Ifju P. High Sensitivity Moiré [M]. Springer-Verlag, New York, 1994.
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