期刊文献+

玻璃-莫来石陶瓷复合材料基板的研究 被引量:3

Study of Glass-mullite Ceramic Composite Substrate
下载PDF
导出
摘要 以低介电常数的玻璃粉末和莫来石粉末为原料,制备了玻璃–莫来石陶瓷复合材料基板.研究了烧结温度和莫来石含量对复合材料的介电性能和抗弯强度的影响.结果表明,当莫来石质量分数为50%时,玻璃–陶瓷复合材料经1 000℃、2 h的烧结后,其相对介电常数εr为4.6、介质损耗tgδ为0.008、抗弯强度σ为90 MPa.另外,该复合材料在200~600℃之间的热膨胀系数约为4.0×10-6℃-1,与Si、GaAs等半导体材料的热膨胀系数相近,可望作为优质封装材料应用. The glass-mullite ceramic composite substrate have been prepared in the paper, using glass powder with low dielectric constant and mullite powder as starting materials. The effect of the sintering temperature and the mullite content on the dielectric properties and the bending strength has been studied. The results show that when the mullite content is 50%, the relative dielectric constant reaches 4.6, the dielectric loss reaches 0.008 and the bending strength reaches 90 MPa after the glass-mullite composite material are sintered for 2 h at the temperature of 1000℃. The thermal expand coefficient of the composite material,similar to Si or GaAs semiconductor, is about 4.0×106℃1 in the temperature range of 200~600℃,so it can be used as good package materials.
出处 《电子元件与材料》 CAS CSCD 北大核心 2004年第4期36-38,共3页 Electronic Components And Materials
基金 江苏省高校自然科学研究资助项目(01KJB430002)
关键词 莫来石 复合材料 基板 封装 mullite composite substrate package
  • 引文网络
  • 相关文献

参考文献3

共引文献9

同被引文献43

  • 1王少洪,周和平,陈克新.高频片式电感用堇青石陶瓷材料的低温烧结和性能[J].稀有金属材料与工程,2005,34(2):325-328. 被引量:6
  • 2靳正国,徐廷献,胡宗民,高尚通,王文琴,刘志平.莫来石基板陶瓷的组成对结构与性能的影响[J].硅酸盐学报,1996,24(1):20-27. 被引量:5
  • 3董兆文,王岩.低温共烧玻璃陶瓷基板材料的研究[J].电子元件与材料,1996,15(6):28-32. 被引量:7
  • 4Yue Zhen- Xing, Zhou Ji. Low- temperature Sinterable Cordierite Glass-ceramics for High- frequency Multilayer Chip Inductors [J]. J. Mater. Sci. Lette.,2000, (19):213-215.
  • 5Hsu Jen-Yan,Lin Hon-Chin,Shen Hon-Dar, et al.High Frequency Multilayer Chip Inductor [J].IEEE. Transaction on Magnetics, 1997, 33(5) : 3325 - 3327.
  • 6Masami Sasaki, Hiroshige Okawa,Yasuyoshi Suzuki, et al.Non-magnetic Ceramics and Ceramic Multilayer Parts: US,6008151[P]. 1998- 06- 03.
  • 7Jeana J H, Gupta T K. Design of Low Dielectric Glass^+ Ceramics tor Multilayer Ceramic Substrate [J]. IEEE.Trans. Compon, Hybids, Manut. Technol, 1994, 17(2) :228-233.
  • 8Jean J H, Kuan T H. Compositional Design and Properties of a Low-k Silica Dielectric for Multilayer Ceramic Substrate [J ]. Jpn.J. Appl. Phy, 1995(34) : 1901 - 1905.
  • 9Markstein Howard W. A Wide Choice of Materials for MCMs [J]. Electronic Packaging & Production, 1997,37(3):34-38.
  • 10Coterene E. Ceramic Multichip Module and High Density Thick Film Interconnect Technology [J].Electronic Packaging & Production, 1998,38(4) : 43 - 48.

引证文献3

二级引证文献8

;
使用帮助 返回顶部