一种TO金属帽封装器件引脚折弯设备研制

Development of a pin bending device for TO metal cap packaging device

本文提出了一种TO金属帽封装器件引脚折弯解决方案,并依此方案研制了半自动折弯设备。本文从工艺要求、总体方案设计、元件抱紧机构、上模执行机构、下模执行机构等方面进行了阐述。TO金属帽封装器件引脚折弯设备的研制提高了该工序折弯效率尤其是多引脚元件,提升了引脚折弯质量一致性。

In this paper,a solution to the pin bending of TO metal cap packaging device is proposed,and a semi-automatic bending device is developed according to this solution.In this paper,the process requirements,overall design,component holding mechanism,upper mold actuator,lower mold actuator and other aspects are described.The development of pin bending equipment for TO metal cap packaging device improves the bending efficiency of this process,especially for multi pin components,and improves the consistency of pin bending quality.