摘要
随着环境保护意识的增强,人们更清楚意识到铅的剧毒性给人类健康、生活环境带来的严重危害,全球范围已相继立法规定了使用含铅电子焊料的最后期限,无铅封装,无铅焊料成为了近年来的研究热点问题。本文主要叙述了研究无铅焊料的驱动力,以及无铅焊料须满足的基本要求、常用无铅焊料的优缺点和改进方法,同时介绍了无铅化焊接由于焊料的差异和工艺参数的调整,给焊点可靠性带来的相关问题。
It was a hot problem on lead-free solder around the world. This paper was to cover the cause and requisition of the application of lead-free solder .the advantage and disadvantage of the character on lead-free solder was introduced, and the reliability of lead-free solder joint were discussed. The lead-free problems and status of china are also briefly presented.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2005年第4期490-494,共5页
Journal of Functional Materials
基金
军事电子预研资助项目(41323030412)
关键词
无铅焊料
焊点
可靠性
lead-free solder
solder joint
reliability
