LTCC及其在三维微波集成电路中的应用

LTCC and Its Application for Three Dimensional Microwave Integrated Circuits

介绍了用于三维微波集成电路(3D-MIC)的新技术LTCC(低温共烧陶瓷)的物理性能及主要特点;阐述了LTCC的制作工艺;重点讨论了基于LTCC的三维微波集成电路和内埋无源元件技术。

This paper introduces physical properties and major characteristics of LTCC （ low temperature cofired ceramic）, which is a new technology used for three dimensional microwave integrated circuits（ 3D - MIC）. Schedule drawing of LTCC is presented. Emphasis is placed on LTCC - based 3D - MIC and technology of embedded passive components.