碘化钾类稳定剂在化学镀Ni-P工艺中的应用

Application of KI Stabilizer in Electroless Ni-P Alloy Plating Process

文摘在合理选择化学N i-P合金配方和工艺条件的前提下,采用对比试验比较了几种稳定剂对化学镀N i-P合金镀液及镀层性能的影响,选取合适的工艺参数,采取正交试验方案,研究了KI与其他稳定剂复配时的性能变化规律,探讨了KI的稳定机理。结果表明,各稳定剂之间有的相互兼容、相互促进,有的则相互抵触、相互削弱对方的作用。复合稳定剂综合性能的提高程度明显优于单稳定剂,获得了复合稳定剂KI与Pb(Ac)2质量浓度分别为8 g/m3和1.2 g/m3匹配的最佳工艺参数。

By choosing reasonable system for electroless Ni-P alloy plating with lactic acid, effect of some stalizers compound are studied. The stability mechanism of KI stabilizer is explored. Data indicate some stabilizers are compatible and can facilitate each other, but some of them go against and weaken each other. Complex stabilizers are obviouly better than single stabilizer. The best match parameters for the complex stabilizer KI and Pb （ Ac ） 2 with mass concentration of 8 g/m^3 and 1.2 g/m^3 respectively obtained.