摘要
A new method of collision-free path plan integrated in virtual processing is developed to improve the efficiency of laser surface hardening on dies. The path plan is based on the premise of no collision and the optimization object is the shortest path. The optimization model of collision-free path is built from traveling salesman problem （TSP）. Collision-free path between two machining points is calculated in configuration space （C-Space）. Ant colony optimization （ACO） algorithm is applied to TSP of all the machining points to find the shortest path, which is simulated in virtual environment set up by IGRIP software. Virtual machining time, no-collision report, etc, are put out atter the simulation. An example on autobody die is processed in the virtual platform, the simulation results display that ACO has perfect optimization effect, and the method of virtual processing with integration of collision-free optimal path is practical.
A new method of collision-free path plan integrated in virtual processing is developed to improve the efficiency of laser surface hardening on dies. The path plan is based on the premise of no collision and the optimization object is the shortest path. The optimization model of collision-free path is built from traveling salesman problem （TSP）. Collision-free path between two machining points is calculated in configuration space （C-Space）. Ant colony optimization （ACO） algorithm is applied to TSP of all the machining points to find the shortest path, which is simulated in virtual environment set up by IGRIP software. Virtual machining time, no-collision report, etc, are put out atter the simulation. An example on autobody die is processed in the virtual platform, the simulation results display that ACO has perfect optimization effect, and the method of virtual processing with integration of collision-free optimal path is practical.
基金
This project is supported by Great Device Development Project of Chinese Academy of Sciences, China(No.[1997]167)Knowledge Innovation Great Project of Chinese Academy of Sciences, China, in 2000-2003(No. KGCX1-11).
