摘要
利用磁控溅射产生金属Cu团簇,同时蒸发CaF_2介质,将Cu团簇包埋在CaF_2介质中。团簇大小可通过改变溅射气压控制。用TEM研究了嵌埋团簇的结构。分析结果表明:Cu团簇呈三角状多晶结构,团簇大小为10~70Mmm,基质CaF_2晶体也为多晶结构。Cu团簇的晶格常数在包埋状态下发生了膨胀,膨胀率大约在16%左右。
By using magnetic controlled sputter and evaporation device Cu clusters embedded in CaF_2,have been successfully prepared.TEM is used in studying the micro structures.The results show that the copper cluster is well embedded in CaF_2 and the size of the triangle-shaped grains,Cu clusters,is from 10nm to 70nm.The Cu cluster and medium CaF_2 are both polycrystalline structure,and the Cu cluster's lattice constant expands about 16%.
出处
《材料科学与工艺》
CAS
CSCD
北大核心
1996年第4期72-75,共4页
Materials Science and Technology
基金
国家自然基金
优秀青年教师基金
关键词
嵌埋团簇
晶体结构
晶格膨胀
embedded cluster,micro structure,lattice expansion.