CuNiMn/30CrMnSi整体材料界面过渡层的研究

Investigation on the Interface Transition Layer of CuNiMn/30CrMnSi Integral material

研究了CuNiMn/30CrMnSi整体材料界面过渡层的溶化过程。通过设计和控制不同的CuNiMn/30CrMnSi整体材料界面过渡层,获得了比CuNiMn合金本体强度更高的界面结合强度。文中也分析了界面过渡层的成分与微观结构。

The CuNiMn/30CrMnSi Integral material was prepared by casting, The influence of the melting holding time on the thickness of interface transition layer was investigated. The results show that with the increase of melting holding time, the interface transition layer becomes thick at the beginning, followed by a thin layer, and finally disappeared. Through controlling the interface transition layer between CuNiMn alloy and 30CrMnSi in the composite, the boundary strength is higher than that of CuNiMn alloy itself. The interface composition and microstructure of CuNiMn/ 30CrMnSi Integral material was studied by OM and SEM as well.