板坯连铸结晶器铜板热机耦合应力分析

Thermal and Mechanical Couple Stress Analysis of Mould Copper for Slab Continuous Casting

通过对大板坯连铸结晶器铜板热电偶的实测温度数据的分析,获得了铜板温度场分布的基本规律,在考虑钢水、铸坯、铜板以及接触面介质的物理参数随温度变化的前提下,依托有限元软件ANSYS对结晶器铜板的动态温度场、耦合应力场进行动态仿真,获得了铜板在三排热电偶高度上的温度分布与耦合应力应变规律,研究结果为了解铜板的应力/变形情况以及铸坯缺陷分析提供了较好的数据参考。

With thermocouples set on the back of mold copperplate, the temperature distribution was measured. Considering the change of physical parameters of liquid steel, strand, copper and media on interface with temperature, the dynamic temperature field and couplestress of mould copper in range of three-row thermocouples were simulated by FEA soft ANSYS. The results provided a good reference for copper stress distribution and defect analysis.