摘要
对SU-8胶的热溶胀效应及其机理进行了研究,在现有微模具的UV-LIGA工艺的基础上,利用AN-SYS对SU-8胶的热溶胀性规律进行了仿真分析。通过SU-8胶模的溶胀实验,建立了热溶胀变形的速率模型,并计算了不同电铸时间下微模具的顶部线宽,计算结果与实验值基本吻合。仿真结果可用来优化掩模图形的设计及预测电铸后微模具的尺寸。
Thermal swelling of SU-8 photoresist and its mechanism were investigated. Basing on the fabrication of micro mold insert by existing UV-LIGA technique, regularity of SU-8 thermal swelling was simulatively analyzed with ANSYS. The deforming rate model of thermal swelling was build through the experiment of swelling. And the feature widths of micro mold under different electroforming time were calculated. Comparing the calculative results with experimental results, a good agreement between them was acquired. This study was beneficial to optimizing mask design and predicting the dimensions of electroformed micro mold insert.
出处
《压电与声光》
CSCD
北大核心
2008年第5期621-623,共3页
Piezoelectrics & Acoustooptics
基金
国家自然科学基金资助项目(50675025)
