基于田口方法的合金薄膜铜衬底超精密抛光工艺优化研究

Parameters Optimization on the Polishing Process for the Alloy Films on Copper Substrates Based on Taguchi Method

为了获得性能优良的电化学沉积合金薄膜,需要精度非常高的合金薄膜铜衬底。以铜衬底表面粗糙度Ra和Rt为评价目标,探讨了基于田口方法的铜衬底抛光工艺参数优化设计方法。在给定工件材料和磨料(种类和粒度)的条件下,加工载荷、磨料浓度和加工速度是影响铜衬底抛光表面质量的主要工艺参数。运用田口方法进行了实验设计,并通过对实验结果的分析,得出了最佳的抛光工艺参数组合,采用该实验条件进行加工获得了非常光滑的铜衬底表面(Ra6 nm,Rt60 nm),表明田口方法能够有效的应用于铜衬底抛光工艺参数的优化设计和分析。

To obtain the amorphous alloy films with superior properties by electrochemical deposition, the accuracy requirement of copper substrates is extraordinarily strict. The application of Taguchi method for optimization of copper substrate polishing process parameters to obtain the best finish was introduced. An optimization experiment for polishing copper substrate with diamond was designed by Taguchi method. Surface roughness Ra and Rt are considered as criteria for optimization. Influence of parameters involving load, speed, and slurry concentration for a given workmaterial with given abrasive （material and size） are discussed, and the optimum polishing conditions are figured out,and super smooth surface （Ra 6 nm, Rt 60 nm） is obtained under this conditions. It illustrates that the experiment design based on Taguchi method can successfully applied to determine the optimum processing conditions for copper substrate polishing process.