新型太阳能级硅片切割技术

New Cutting Technology of Solar-cell Silicon Wafers

提出了一种基于复合工作液的以电火花放电加工技术对半导体硅材料进行切割的新方法,研制了标准太阳能级硅切割专用夹具。结果表明高速走丝电火花线切割(HS-WEDM)对半导体硅切割具有效率高、材料损耗小、表面平整度好等特点,经检测切割效率大于100mm2/min,并且该技术能够实现大尺寸薄片切割,目前最大加工直径超过200mm,硅片厚度可控制在120μm以内。该工艺方法为探索进一步提高半导体硅材料放电切割效率,提高硅材料利用率以降低太阳能电池成本,拓展半导体材料的电火花加工方法,并形成具有我国自主知识产权的太阳能级硅高效放电切割技术提供了理论及实践依据。

A new technology was researched,which is based on complex dielectric fluid and used for cutting silicon through electrical discharge maching（EDM）.At the same time,a special fixture used for cutting standard solar-cell silicon wafers was designed.It is evidenced that the silicon cut by wire cut electric discharge machining with high traveling speed（HS-WEDM） process has the advantages of high efficiency、low loss、high quality surface flatness.And the cutting efficiency is higher than 100mm^2/min.Therefore,this technique can be used for cutting large-scale slices.At present,the largest machining diameter can reach 200mm,and the thickness of the slices is less than 120μm.Besides,this technique can provide a theoretical and practical basis for improving the machining efficiency of discharged cutting on semiconductor silicon,improving the utilization efficiency of silicon to decrease the cost of silicon,expanding the EDM method to semiconductors,forming a technique with China＇s own intellectual property rights and high efficient discharge cutting of solar silicon.