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三维微波集成电路的发展 被引量:5

The Development of Three Dimensional Microwave Integrated Circuits
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摘要 近几年来,三维微波集成电路的研制在各方面均取得了一定的进展,作为新一代体积更小的微波集成电路,必将随着信息时代的发展,在移动通信、卫星直播电视等装置中获得广泛应用。本文综述三维微波集成电路近几年来的发展。 The study of three dimensional microwave integrated circuits (3DMIC) has made great progress in recent years. As a new generation of microwave integrated circuit with smaller size, 3DMIC will be widely used in mobile communication equipments, satellite direct broadcasting television equipments and so on. In this paper, a survey about the development of three dimensional microwave integrated circuits in recent years is given.
出处 《微波学报》 CSCD 北大核心 1999年第2期167-173,共7页 Journal of Microwaves
基金 国家自然科学基金
关键词 三维 微波集成电路 单片 多层 Three dimensional microwave integrated circuit (3DMIC),Three dimensional monolithic microwave integrated circuit (3DMMIC), Multilayer microwave integrated circuit(MuMIC)
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同被引文献17

  • 1李斌颖,安红明,王念慈.屏蔽微带线宽频域色散特性[J].微波学报,1989,5(3):10-17. 被引量:8
  • 2陈兴国,李佩,刘同怀,黄鲁.新型的轻小型化雷达接收机的研制[J].电子技术应用,2005,31(5):57-59. 被引量:6
  • 3Chiao J,IEEEMTTS Dig,1999年,463页
  • 4Chen Y C,IEEE Microwave Guided Wave Lett,1998年,8卷,11期,399页
  • 5Lai R,IEEE Microwave Guided Wave Lett,1998年,8卷,11期,393页
  • 6顾墨琳,现代雷达,1991年,13卷,5期,70页
  • 7Liu Dongtian,IEEEMTTS Dig,1986年,265页
  • 8Raymond L. Brown, et al. Manufacturing of Microwave Modules Using Low-Temperature Cofired Ceramics.IEEE MTT-S Digest. 1994: 1727 ~ 1730.
  • 9Baliga John. Packaging Provides Viable Alternatives to SoC. Semiconductor International, 2000, 23 (8).
  • 10Tsuneo Tokum itsu, etal. Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMIC. IEEE MMWMCS Proc.,1996,(6): 85 ~88.

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