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Sn基钎料与Cu和Al基板的润湿性比较研究 被引量:3

Comparison of wetting properties for Sn-based solders on copper and aluminum substrates
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摘要 采用润湿平衡法测量了四种Sn基钎料(Sn-37Pb、Sn-3.0Ag-0.5Cu、Sn-0.7Cu与Sn-9Zn)分别在250,260和270℃与Cu、Al两种基板的润湿性能。结果表明:钎料与Al基板的润湿时间均比Cu基板长,除Sn-9Zn外,其他三种钎料与Cu基板的润湿力比Al基板大,并且随着温度升高,润湿性能提高,其中以Sn-9Zn最为明显,270℃时的润湿力达3.68mN。钎料在Cu基板上的润湿性能主要取决于钎料本身的表面张力,而钎料在Al基板上的润湿性能受钎料合金表面张力以及钎料与Al基板间的相互作用两个因素的影响。 The wetting properties of four typical Sn-based solders,i.e.Sn-37Pb,Sn-3.0Ag-0.5Cu,Sn-0.7Cu and Sn-9Zn,on copper and aluminum substrates at 250,260 and 270 ℃ were evaluated adopting wetting balance method.The experimental results show that the wetting times of all solders on copper substrate are less than on aluminum substrate,the wetting forces of the solders with copper substrate are bigger than with aluminum substrate except Sn-9Zn solder.The wetting properties of the solders on aluminum substrate increases with the elevation of soldering temperature,the wetting force of Sn-9Zn increases most obviously among four solders and reaches 3.68 mN at 270 ℃.The experiments also show that the wetting properties of solders on copper substrate mainly depend on surface tension of solder alloy,however,depend on both surface tension of solder alloy and interaction with aluminum substrate on aluminum substrate.
出处 《电子元件与材料》 CAS CSCD 北大核心 2011年第1期75-78,共4页 Electronic Components And Materials
基金 重庆市教委科学技术研究资助项目(No.KJ101404)
关键词 Sn基钎料 润湿性能 Cu基板 Al基板 Sn-based solders wetting properties copper substrate aluminum substrate
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