摘要
采用元素粉作为原料,通过热等静压技术(HIP)制备出50%SiP/Al-Cu和70%SiP/Al-Cu(体积分数)复合材料,研究固溶处理和峰值时效处理对复合材料显微组织、Al2Cu相溶解过程及力学性能的影响。结果表明:热等静压技术制备的SiP/Al-Cu复合材料完全致密,组织均匀细小,材料由Si相、Al相和Al2Cu组成,白色Al2Cu相产生于原始的Cu粉与Al粉界面处。在516℃固溶处理2h后,70%SiP/Al-Cu复合材料中的Al2Cu相全部溶入Al基体中,而50%SiP/Al-Cu复合材料中还残留少量Al2Cu相。经过峰值时效处理后,50%SiP/Al-Cu和70%SiP/Al-Cu复合材料的抗弯强度为548MPa和404MPa,相对于热等静压态分别提高了38.81%和13.51%,复合材料的强度显著增强。
50%SiP/Al-Cu and 70%SiP/Al-Cu composites were prepared by hot isostatic pressing(HIP) method using pure elemental powders.The microstructure evolution and dissolution of Al2Cu were studied.The properties of as-hot isostatic pressed composites before and after heat treatment were also investigated.The results show that the prepared SiP/Al-Cu composites are fully dense.The silicon particles well distribute in Al matrix and still keep the original size.The presence of Al2Cu,Si and Al is identified in the as-hot isostatic pressed composites.The Al2Cu phase is formed in the boundaries of the Cu and Al particles.After solution treatment,Al2Cu phase dissolves into the 70%SiP/Al-Cu composites,however,some Al2Cu phase does not dissolve into the matrix of 50%SiP/Al-Cu composites completely.After the peak-aged treatment,the bending strength of 50%SiP/Al-Cu and 70%SiP/Al-Cu composites as-peak-aged is 548 MPa and 404 MPa,which is increased by 38.81% and 13.51% compared with that of as-hot isostatic pressed,the three points bending of the composites can be improved remarkably.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
2013年第2期111-117,共7页
Acta Materiae Compositae Sinica
关键词
热等静压
热处理
SIP
AL-CU复合材料
微观组织
力学性能
hot isostatic pressing(HIP)
heat treatment
SiP/Al-Cu composites
microstructure
mechanical properties