微波集成电路的发展趋势

Development Trend of Microwave Integrated Circuits

回顾了第一代波导立体电路、第二代微波混合集成电路和第三代微波单片集成电路与多芯片组件的发展,介绍了第四代片上系统、系统级封装和封装级系统,对比总结了各自的关键技术、特点和应用,并对微波集成电路今后的发展趋势做出展望。

In this paper, the development of microwave integrated circuit（MIC） which is characterized by first-gener- ation waveguide circuit, second-generation hybrid MIC and up to third-generation monolithic MIC and multi-chip module is reviewed. The fourth-generation system on chip（SOC）, system in package （SIP） and system on package （SOP） is also intro- duced. The respective key technologies, features and applications are summarized and compared. Finally, the future of devel- opment trend for MIC is prospected.