摘要
采用0.18μm CMOS SOI工艺技术研制加工的单刀双掷射频开关,集成了开关电路、驱动器和静电保护电路。在DC^6GHz频带内,测得插入损耗0.7dB@2GHz、1dB@4GHz、1.5dB@6GHz,隔离度37dB@2GHz、31dB@4GHz、27dB@6GHz,在5GHz以内端口输入输出驻波比≤1.5:1,输入功率1dB压缩点达到33dBm,IP3达到42dBm。可应用于移动通信系统。
A single-pole double-through(SPDT) RF switch has been designed and fabricated using 0.18 μm CMOS SOI technology. It integrates switch circuits, drivers and ESD protect circuits. The measurement results are as follows: in the frequency range of DC-6 GHz, insertion loss≤0.7 dB@2 GHz, 41 dB@4 GHz,≤1. 5 dB@6 GHz; isolation≥37 dB@2 GHz, ≥31 dB@ 4 GHz, ≥27 dB@6 GHz, input and output VSWS≤1. 5.1 within 5 GHz, input 1 dB compression point P-1db≥33 dBm, IP3≥42 dBm. This switch is applicable for mobile communication system.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2014年第2期142-145,162,共5页
Research & Progress of SSE
关键词
互补金属氧化物半导体
绝缘衬底上硅
射频开关
驱动器
集成
complementary metal oxide semiconductor(CMOS)
silicon-on-insulator(SOI)
RF switch
driver
integration