Effects of reflowing temperature and time on alloy layer of tinplate and its electrochemical behavior in 3.5%NaCl solution

软熔处理温度和时间对镀锡钢板中合金层及其在3.5% NaCl溶液中腐蚀电化学行为的影响(英文)

Effects of reflowing temperature and time on the alloy layer of tinplate and its electrochemical behavior in 3.5%NaCl solution were investigated by electrochemical measurements and surface characterization.It is found that the amount of alloy layer increases with the increase of reflowing temperature and time.Then the corrosion potential of detinned tinplate shifts positively and the corrosion rate decreases.After being coupled with tin,the detinned tinplate acts as cathode and tin acts as anode initially.However,after being exposed for some time,the potential shifts of both detinned tinplate and tin reverse the polarity of the coupling system.The galvanic current density decreases with the increase of reflowing temperature and time.

利用电化学测试和表面分析方法研究软熔处理温度和时间对镀锡钢板中合金层及其在3.5%NaC1溶液中腐蚀电化学行为的影响。结果表明:随着软熔处理温度和时间的增加,镀锡钢板的合金层数量增多。且腐蚀电位正移,对应腐蚀速率下降。与锡偶接后,在初始阶段,脱锡处理后的镀锡钢板为阴极而锡为阳极。然而经过一段时间后,电偶对的极性反转。随着软熔处理温度和时间的增加,电偶电流下降。