Microstructural development and its effects on mechanical properties of Al/Cu laminated composite

Al/Cu多层复合板的组织演化及其对力学性能的影响(英文)

The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope（TEM）, scanning electron microscope（SEM）, peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.

研究异步冷轧退火工艺制备的Al/Cu多层复合材料的组织演化及其对力学性能的影响。采用SEM和TEM分析界面组织,用界面剥离实验和拉伸实验测试复合板的力学性能。结果表明:异步冷轧复合工艺可以获得界面紧密连接的超细晶多层复合材料。退火促进Al和Cu连接界面上金属原子的扩散,甚至导致金属间化合物的生成。复合板的连接界面在300°C退火时发生固溶强化现象,界面的连接强度达到最大,但是在更高温度退火时界面生成的金属间化合物导致连接性能急剧下降。在300°C退火时,复合板组织发生再结晶并获得较高的抗拉强度;而在350°C退火时,界面存在亚微米厚度的过渡层,有利于位错滑移运动,因此复合板获得较高的伸长率。