GH710合金盘件超声检测杂波水平与组织特征分析

Analysis on Ultrasonic Inspection of Noise Level and Microstructure Characters of GH710 Alloy Disc

分析了挤压+等温锻造工艺联合成形的GH710合金盘件在热处理前后的超声检测杂波水平,并对超声检测单显信号进行了定位及多层次切片金相组织观察。结果表明:热处理引起的晶粒长大,使得GH710合金盘件在热处理前后的杂波水平差异较大,而热处理前的杂波水平差异较小,有利于对内部冶金缺陷的检测。单个粗大晶粒是盘件热处理前后产生单显信号的主要原因,单个粗大晶粒尺寸不超过1.3mm,满足技术条件中对单个粗大晶粒小于1.5mm的要求,且未发现影响盘件使用安全的冶金类缺陷存在。

The ultrasonic inspection ofnnise level in GH710 alloy disc gotten by extrusion and isothermal die forging was investigated before and after heat treatment. Meanwhile, the unusual single indications was locate＆ The microstructure of multi-level of the alloy was observed. The results show that the grain growth due to heat treatment makes a lower noise level of GH710 alloy disc before heat treatment, it is beneficial to discover the metallurgy defects before heat treatment. The unusual single indications appear before and after heat treatment are caused by large grains, and the size of the single large grain is less than 1.5mm which has met the requirement. Overall, the metallurgy defects which infect the safety of disc cannot be found.