摘要
采用超音速紧耦合气雾化法制备Sn0.3Ag0.7Cu无铅焊锡粉末,利用扫描电子显微镜和激光粒度分析仪分别对雾化粉末的微观形貌和粒度分布进行表征,分析了雾化过程及工艺条件(熔体过热度、雾化气体压力、雾化室氧含量)对粉末微观形貌的影响。结果表明:高的熔体过热度和大的雾化气体压力均有利于高球形度粉末的形成,但熔体过热度的增大使卫星球数量增加,雾化气体压力的增大使超细粉末、镶嵌粉末增多;雾化室内部氧含量的降低能提高粉末的球形度及表面光洁度。雾化过程中雾化室内部气流的紊乱对卫星球等粉末缺陷有重要影响。
Sn0.3Ag0.7Cu lead-free solder powders were prepared by supersonic gas atomization equipment. The scanning electron microscope and laser particle size analyzer were used to characterize the micro morphology and size distribution of the powder respectively. The effect of atomization process and process parameters on the morphology of SAC0305 was analyzed. The results show that higher melt temperature and atomization pressure are beneficial to the formation of powder with high sphericity.However,higher melt temperature leads to much more satellite ball particles,and higher atomization pressure leads to the appearance of superfine powder and inlaid powder. With the reduction of oxygen content in atomizer chamber,the sphericity and surface smoothness of powder increase. The disorder of air flow in atomizer chamber during atomization process has important influence on the quality of powder.
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2015年第6期86-89,共4页
Ordnance Material Science and Engineering
基金
陕西省教育厅重点实验室科研计划项目(14JS069)
陕西省教育厅自然科学专项资金资助项目(02JK133)
