高效硅片切割液TF-033的研究

Study on Efficient Silicon Wafer Cutting Fluid TF-033

通过分子构效关系的研究及合理的配方设计,以低泡嵌段聚醚和梳型结构分散剂为主要原料,添加润湿剂、抗氧化剂、防腐剂、消泡剂等表面活性剂,研制了一种硅片切割液TF-033。它具有低粘度、高分散性、高润滑性等特点。一方面能有效解决因砂浆沉积引起的脏污片问题,提高切片稳定性和成品率,另一方面大幅降低了设备能耗,进而达到降本增效的目的。

Through molecolar structure-activity relationship and rational formula design, with low foam block polyether and comb type structure dispersants as the main raw material, adding wetting agents, antioxidants, preservatives, defoaming agent, such as surfactant. the silicon wafer cutting fluid TF-033 was developed. It had low viscosity, high dispersion, high lubrication, etc. On the one hand, can effectively solve the problem of smudgy piece caused by mortar deposition, improve the slice stability and yield. On the other hand,can greatly reduce the energy consumption of equipment,thus achieve the goal of authors.