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镀金插头中置换反应导致金镍剥离理论的提出和机理研究

A study on the mechanism and the mechanism of the reaction of gold and nickel with the substitution reaction in gold plated finger
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摘要 镀金插头制程中因为设备、药水未管控到位常出现各种各样的金镍剥离或其他缺陷,但是由于置换反应导致的金镍剥离在业界的研究较少见。通过对大量金镍剥离板的参数进行分析比对,提出了金缸置换反应导致金镍剥离的理论,并且通过设计试验论正,证明理论成立。 Because of the equipment, and because the liquid medicine is not controlled in place, gold plating finger process often appear all kinds of gold and nickel stripping or other defects. Butthe gold nickel strip due to the replacement reaction, in the industry the research is rare. Through analyzing and comparing the parameters of a large number of gold and nickel strip plates, the theory of the metal nickel stripping was put forward, and the theory was proved by the design of the test.
出处 《印制电路信息》 2017年第A01期224-232,共9页 Printed Circuit Information
关键词 镀金插头 金镍剥离 置换反应 Gold Plated Finger Gold Nickel Strip Replacement Reaction
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