摘要
文章浅析的缺陷主要围绕我公司(一铜与二铜流程)之孔内空洞的几个大类进行分析与探讨。所谓孔内无铜,即导通孔内局部孔破或环状孔破,而现有传统的电测法对部分孔无铜难以检测,如漏至客户处将有潜在的风险。
In this paper,several categories of holes in a company(electroless copper and graphics electroplating)are mainly analyzed and discussed.The main phenomenon of copper-free hole is local hole-breaking or ring holebreaking.The existing electrical testing methods cannot achieve 100%detection of this problem.If the defective product is leaked to the customer,there will be a big quality hazard.
作者
张仁军
李波
杨海军
胡志强
Zhang Renjun;Li Bo;Yang Haijun;Hu Zhiqiang
出处
《印制电路信息》
2020年第9期34-38,共5页
Printed Circuit Information
关键词
孔内空洞
药水异常
特殊设计
过程控制
渐薄型
Potions in Holes
Abnormal Potion
Special Design,Process Control
Gradually Thin
