微波混合集成电路的三维集成设计研究

Research and Design on 3D Integration of Microwave Hybrid Integrated Circuit

介绍了一种可实现微波混合集成电路三维集成的设计方法。该方法在陶瓷基板上采用薄膜混合集成工艺制作多层薄膜电路结构,利用球栅阵列连接实现多个基板的三维集成互联组装。该设计可使混合集成电路的集成度进一步提高,并可改善安装方式和调试难度。同时对三维集成设计方式和应用特点进行了分析和研究,为小型化混合集成电路应用提供了有效的解决方案。

A three-dimensional(3 D)integrated design method for microwave hybrid integrated circuit was introduced in this paper.Based on the ceramic substrate,the multilayer thin-film circuit structure was realized by using thin film hybrid integrated process.Multi-substrates could be assembled and interconnected in 3 D integration using ball grid array connectors.This design method can further enhance the integration density of circuit,and makes it easier to install and debug.At the meantime,the 3 D integrated design approaches and application characteristics are analyzed and studied,which provides an effective solution for miniaturization application of hybrid integrated circuit.