薄形陶瓷板釉泡、孔洞影响因素探讨

Discussion on Influence Factors of Glaze Bubble And Hole in Thin Ceramic Board

薄形陶瓷板作为一种可持续发展陶瓷产品越来越受到人们的欢迎。但是,在生产薄形陶瓷板过程中,非常容易产生釉泡、孔洞等缺陷。笔者从各个工序探讨了产生釉泡、孔洞缺陷的影响因素。通过研究发现,产生这些缺陷的主要原因是因为坯体里的硫酸盐和碳酸盐在分解过程中排气不充分导致。最后结果表明:通过在坯体配方中降低高CaO含量的原材料比例原料加工过程中避免使用脱硫水,加强喷雾塔的操作控制,坯体表面施加化妆土,以及其它工艺过程控制,可以有效地减少釉泡、孔洞缺陷。

Thin ceramic board as a sustainable development ceramic product is more and more welcomed by people.However,glaze bubble and hole defects are very produced easily in the process of manufacturing thin ceramic board.Influence factors of producing glaze bubble and hole defects were discussed from each process in this paper.The research finds that the main reason of producing those defects is because of insufficiently exhausting in the process of decomposing sulfate and carbonate from body.Finally,the results indicate that glaze bubble and hole can be reduced effectively by reducing proportion of raw materials with high calcium oxide content in body formula,avoiding use of desulphurization water in raw materials processing,strengthening operation control of spray tower,exerting engobe on the body surface and controlling other technological processes.