印制电路板连通性失效的分析思路和方法研究

Research on analysis ideas and methods of PCB continuity failure

连通性失效是印制电路板最常见的失效模式之一,文章结合典型失效分析案例,重点探讨了连通性缺陷的准确定位方法,失效模式的确认方法,以及失效机理的分析方法等,并总结了遇到该类问题时应正确采取的分析思路和操作流程。

Continuity failure is one of the most common failure modes of PCB.Combined with typical failure analysis cases,this article focuses on the accurate location methods of PCB continuity defect,the confirmation methods of failure mode,and the analysis methods of failure mechanism.This article summarizes the analysis ideas and operation procedures that should be correctly adopted when dealing with such problems.