摘要
The effect of Cu content on the microstructure,grain orientation and mechanical properties of Sn-xCu(x=0-4.0 wt.%)lead-free solder was studied.Results showed that added Cu induced the formation of intermetallic phases.Only theη-Cu;Sn;andε-Cu;Sn phases were present in theβ-Sn matrix.For all contents,the strongly preferred orientation of theβ-Sn phase was formed on the{001}plane.In Sn doped with 1.0 wt.%Cu,theη-Cu;Sn;phase exhibited the preferred orientation of{0001}plane,whereas doping with 3.0 or 4.0 wt.%Cu transformed the preferred orientation to the{010}plane.In addition,only the{0001}and{■}planes were present in theε-Cu;Sn phase.The high Cu contents contributed to an increased number of low-angle boundaries,high residual strain,tensile strength and microhardness.
研究Cu含量对Sn-xCu(x=0~4.0%,质量分数)无铅钎料显微组织、晶粒取向和力学性能的影响。结果表明,Cu的加入诱导了金属间化合物相的形成。β-Sn基体中仅含有η-Cu;Sn;和ε-Cu;Sn相。对于所有Cu含量的样品,β-Sn相沿{001}面形成强的择优取向。当Sn中掺杂1.0%Cu时,η-Cu;Sn;相具有{0001}面的择优取向,而当掺杂3.0%或4.0%Cu时,择优取向转变为{010}面。此外,ε-Cu;Sn相仅存在{0001}和{■}面。高Cu含量有助于增加低角度晶界的数量,提高残余应变、抗拉强度和显微硬度。
作者
Kannachai KANLAYASIRI
Niwat MOOKAM
Kannachai KANLAYASIRI;Niwat MOOKAM(Department of Industrial Engineering,School of Engineering,King Mongkut’s Institute of Technology Ladkrabang,Bangkok 10520,Thailand;Department of Industrial and Production Engineering,Faculty of Industry and Technology,Rajamangala University of Technology Rattanakosin Wang Klai Kangwon Campus,Prachuapkhirikhan 77110,Thailand)
基金
Rajamangala University of Technology Rattanakosin and School of Engineering,King Mongkut’s Institute of Technology Ladkrabang for the laboratory support of this research。
