某型钽电容装焊开裂原因及控制措施

Causes and Control Measures for Cracking of A Type of Tantalum Capacitor

片式固体钽电容在回流焊接过程中产生开裂失效的质量问题。对片式钽电容开裂从切片和结构机理分析,通过烘烤试验和称量对比,找到钽电容开裂具体原因,并对烘烤工艺参数实施优化,有效控制该型号钽电容回流焊接过程中的开裂问题。

Aiming at the quality problem of cracking failure of chip solid tantalum capacitors during reflow soldering, the cracking of the capacitors is analyzed from the slicing and structural mechanism. And the specific reasons for the cracking of capacitors are found through the baking and weighing comparison. By optimizing the baking parameters, the cracking problem during reflow soldering of this type of capacitor can be effectively controlled.