车用双面散热IGBT模块随机振动性能分析与应力预测

Random Vibration Performance Analysis and Stress Prediction of Double-Sided Cooling IGBT Module for Vehicle

针对双面散热绝缘栅双极型晶体管(IGBT)模块在车载状态下由不同频率的振动载荷导致的焊料层失效问题,分别从材料和结构两个角度,以直接覆铜(DBC)板陶瓷层材料、陶瓷层厚度以及焊料层厚度为变量,以芯片底面焊料层应力为指标进行随机振动分析优化与应力预测,得到模块结构的最佳参数值组合。3个变量对芯片底面焊料层应力的影响由大到小为:陶瓷层厚度、焊料层厚度、陶瓷层材料。最后提出一种对芯片下焊料层应力的预测模型,相较仿真的准确率为95.61%。该研究结果对车载双面散热IGBT模块的振动性能分析提供参考,同时为模块结构的设计提供理论依据。

Aiming at the failure of solder layer caused by different frequency vibration load in vehicle state of double-sided cooling insulated gate bipolar transistor(IGBT)module,random vibration analysis optimization and stress prediction were carried out respectively from the perspectives of material and structure,taking direct copper bond(DBC)ceramic layer material,thickness and solder layer thickness as variables and chip bottom solder layer stress as index,and the best parameter combination of module structure was obtained.The effects of three variables on the stress of the solder layer on the bottom of the chip are as follows:ceramic layer thickness,solder layer thickness,and ceramic layer material.Finally,a stress prediction model of the solder layer under the chip was proposed,and the accuracy is 95.61%compared with the simulation.The research results provide a reference for the vibration performance analysis of the vehicle-mounted double-sided cooling IGBT module,and provide a theoretical basis for the design of the module structure.