基于SAC305焊料的红外激光植球功率和时间对焊点形态的影响

Effects of Power and Time of Infrared Laser Jet Solder Ball Bonding Process on Solder Joint Shape Based on SAC305 Solder

为了探究工艺参数对激光植球焊点形态的影响,采用激光器波长为1064 nm的激光植球设备对直径0.6 mm的SAC305焊球在覆铜板上进行植球。基于单因素实验法,通过红外测温系统对激光植球熔池温度进行测量,使用3D轮廓测量仪对焊点圆度、铺展直径、焊点高度、小孔直径和小孔深度等参数进行测量。研究了激光功率和加热时间对焊点参数的影响。结果表明,熔池温度在保温区出现先升高后降低的趋势;随着加热时间的增加,冷却区熔池的冷却速率逐渐降低;激光功率的增加使得熔池温度的升温速率增加且冷却区起始温度升高。随着加热时间和激光功率的增加焊点铺展直径和小孔直径相应增大,焊点高度逐渐降低;随着加热时间的增加小孔深度呈现先增大后减小的趋势;随着激光功率增加小孔深度逐渐增大。该研究结果可为植球工艺参数的选择提供参考。

In order to explore the influence of process parameters on the shape of laser jet solder ball bonding process spot,the laser jet solder ball bonding process equipment with a laser wavelength of 1064 nm was used to sold the SAC305 ball with diameter of 0.6 mm on the copper clad laminate.Based on the single factor experiment method,the temperature of the laser ball planting molten pool was measured by the infrared temperature measurement system,and the parameters such as the roundness of the solder joint,the spreading diameter,the height of the solder joint,the small hole diameter and the small hole depth were measured by the 3D profile measuring instrument.The influences of laser power and laser heating time on solder joint parameters were studied.The results show that the temperature of the solder molten pool increases first and then decreases in the heat preservation zone.With the increase of heating time,the cooling rate of the solder molten pool in the cooling zone decreases gradually.With the increase of laser power,the heating rate of the solder molten pool temperature and the initial temperature of the cooling zone increase.With the increase of heating time and laser power,the spreading diameter and small hole diameter of solder joints increase correspondingly,and the height of solder joints decreases gradually.With the increase of heating time,the small hole depth first increases and then decreases.The hole depth increases with the increase of laser power.The research results can provide reference for the selection of solder ball bonding process parameters.