一种可免低温存储的中温固化树脂固化动力学分析

Analysis of Curing Kinetics of a Medium Temperature Curing Resin without Low Temperature Storage

环氧树脂体系(JH2160)为可免低温存储的一种低成本高性能环氧树脂体系。针对JH2160环氧树脂体系的常温储存进行6个月前后固化分析,可知储存半年后的树脂固化反应程度为13.3%,说明此环氧树脂体系常温贮存性好。利用非等温DSC方法对环氧树脂体系(JH2160)进行固化行为研究,使用T-β外推法确定环氧树脂体系(JH2160)的特征固化温度,用Kissinger法和Ozawa法计算体系的活化能分别为78.16kJ/mol和81.03kJ/mol,二者的平均结果得出体系的活化能为79.59kJ/mol;通过Crane法计算出环氧树脂体系(JH2160)反应级数为0.95,确定了JH2160环氧树脂体系的动力学模型。

Epoxy resin system(JH2160)is a low cost and high performance epoxy resin system which can be stored without low temperature.According to the curing analysis of JH2160 epoxy resin system before and after 6 months of storage at normal temperature,the curing reaction degree of resin after 6 months of storage is 13.3%,indicating that this epoxy resin system has good storage ability at normal temperature.The curing behavior of epoxy resin system JH2160 was studied by non-isothermal DSC method,and the characteristic curing temperature of the resin system was determined by T-extrapolate method.The activation energies of the system were calculated by Kissinger method and Ozawa method as 78.16kJ/mol and 81.03kJ/mol,respectively.The average activation energy of the two systems is 79.59kJ/mol.Crane method was used to calculate the reaction order of epoxy resin system(JH2160)as 0.95,and the kinetic model of JH2160 epoxy resin system was determined.