晶圆电镀装备研发关键技术及其表界面基础

Key technologies and interfacial fundamentals of wafer plating equipment

电镀在半导体金属化和封装工艺中扮演着重要的角色.本文综述了晶圆电镀装备的发展历程,针对电镀装备研发中涉及的表界面基础和技术问题,如金属表界面的性质、电极界面的反应、多物理场耦合等对镀层质量和均匀度的影响及其解决方案进行了概述.最后对晶圆电镀装备的未来发展进行了展望,希望对我国晶圆电镀装备的研发提供参考.

Electroplating plays an important role in semiconductor metallization and package process.In this paper,the development of wafer plating equipment is reviewed,and the interfacial problems(such as the nature of metal surface,electrode interface reaction and multi-physical field coupling)on the quality and uniformity of plating and their solutions are outlined.Finally,the future development of wafer plating equipment is presented,which is expected to provide a reference for the research and development of the wafer-plating technology and equipment.