摘要
Surface metallization of glass fiber(GF)/polyetheretherketone(PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction(XRD), scanning electron microscopy(SEM), and electron backscatter diffraction(EBSD).The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998.The results show that the Cu coating with a thickness of 30 μm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress,bonding strength, and electrical conductivity than the Cu coating deposited by electroplating.
作者
钟利
金凡亚
朱剑豪
TONG Honghui
DAN Min
ZHONG Li;JIN Fanya;CHU Paul K;TONG Honghui;DAN Min(Southwest Institute of Physics,Chengdu 610000,China;City University of Hong Kong,Tat Chee Avenue,Kowloon,Hong Kong 999077,China)
基金
Funded by Shenzhen-Hong Kong Innovative Collaborative Research and Development Program (Nos.SGLH20181109 110802117, CityU 9240014)
Innovation Project of Southwestern Institute of Physics (Nos.202001XWCXYD002, 202301XWCX003)
CNNC Young Talent Program (No.2023JZYF-01)。
